Материнская плата Supermicro MBD A3SEV 4C LN4 O SoC FCBGA1493 Intel Atom FCBGA 1493 SATA M.2 DDR4

Сохранить в закладки 1601010786788:


Цена:316,00 $*

Количество:

  • В избранное

Описание и отзывы

Характеристики



Products Description


A3SEV-4C-LN4-O




Kluczowe cechy / Key features :
1. Intel® Atom® Processor x6425E, Single Socket FCBGA-1493 supported, CPU TDP supports Up to 12W TDP
2. System on Chip
3. Up to 32GB Unbuffered ECC/non-ECC SO-DIMM, DDR4-3200MHz, in 2 DIMM slots
4. 1 PCI-E 3.0 X2 (in x8 slot), 1 M.2 B-Key SATA/PCI-E 3.0 x2/USB 3.0, 3042/2280, 1 M.2 E-Key PCI-E 3.0 x1/USB 2.0, 2230
5. 1 DP (DisplayPort) port, 1 HDMI port, 1 VGA port, 1 eDP (Embedded DisplayPort) port, Supports 3 independent displays
6. Single LAN with Intel® Ethernet Controller I210IT, ONLY i210 support PXE, 3 LAN with 1GbE with Marvell® 88E1512


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Specifications


Basic informations
Chipset
SoC
Format
Mini-ITX
Size
6.7X6.7"
Expansion slots #
1
Processor
CPU socket
FCBGA1493
CPU family
Intel Atom FCBGA-1493
CPU builtin
No
Max. CPU #
1
SNK shape
Standard
System Memory
Max. memory size support
32 GB
Memory sockets #
2
Memory correction support
NON-ECC
Memory size type support
SODIMM
Memory type support
DDR4
On-Board Devices
SATA support
Yes
SATA sockets #
2
SAS support
No
NVMe support
No
M.2 support
Yes
M.2 sockets #
2
NIC #
1
NIC chipset/type
i210IT/1GbE
Hardaware RAID
No
IPMI
No
VGA
No
Other
Supported RSC
N/D
Application
High-efficiency, Cost-effective
Power consumption
12 W


Company Profile


Foshan Runli Technology Co.
Foshan Runli Technology Co., Ltd. is a domestic company with server accessories products, servers, storage, workstations, GPU computing servers, edge computing, high-performance computing and other solutions as its core business. Production advantages and mainland market advantages A service-oriented company that integrates all resources Demand, tailor-made system solutions for customers. Serving a variety of markets including cloud computing, data center, enterprise, big data, high performance computing, artificial intelligence, 5G, IoT, embedded and edge computing.


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