BGA паста из высокочистого материала Оловянная свинцовая металлическая Тип 4 Sn63Pb37 500 г

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BGA IC Solder Paste High Pure Material Tin 63 Lead 37 Type 4 Tin Paste Sn63Pb37 500g


Model
Composition %
Flux
Temp.
Application
Sn63Pb37
63/37
No Clean
183°C
1) Applied in the field of low temperature electronics surface mounting technology, such as solder iron hand soldering, PCB secondary soldering.
2) Application to thermal cut-off, thermal protector, capacitors hearing fuse, etc.
Sn60Pb40
60/40
No Clean
190°C












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Shenzhen Kewei Industry Company, established in 2006, located in Shenzhen, mainly focus on Solder Products R&D, production and distribute to all over the world. Solder products technology support are also 24 hours offline providing.
Currently we have solder wire/solder bar/solder paste/tin anode/tin balls/soldering flux in lead free/halgon free/tin leaded, etc. Soldering tools, SMT spare part and PCB/SMT machines can also be sourced for stable clients.
Plenty of China local authoritative titles and DNV/SGS identification has been in our factory during our growing. We are a member of IPC (International Printed Circuit).











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