Паяльная Оловянная паста паяльная шприц Sn63/Pb37 25 45 мкм для ремонта мобильных телефонов обслуживания компьютеров

JPT4258 lead-free low temperature melting point 138 ℃ is suitable for materials that are not resistant to high temperatures, such as LED beads or cardboard. The solder joints are brittle and can be used to weld electronic products that do not move frequently.

JPT6337 is a universal solder with a lead medium temperature melting point of 183 ℃. The solder joints are bright and have strong workability. It is commonly used for repairing phone tail plugs and soldering SMD components.

JPT628 has a lead and silver content, with a medium temperature melting point of 181 ℃ and a silver content of 0.4%. It is used for electronic soldering that requires crawling tin, and is mostly used for QFN chips and BGA ball planting. The solder joint toughness is stronger than 6337

JPT647 has a lead-free medium temperature melting point of 151 ℃, containing 0.3% silver, and can be welded at a temperature of 220 degrees. It is suitable for wafer welding and some electronic welding that is not resistant to high temperatures.

JPT0307 has a lead-free high-temperature melting point of 227 ℃ and contains 0.3% silver. It can be used for welding high-power components to avoid solder joint displacement and detachment caused by component heating.

JPT305 has a lead-free high-temperature melting point of 217 ℃ and a silver content of 3.0%. Due to the 3% silver content, the strength, toughness, and conductivity of the solder joint are better than the above models. It is used in electronic products that require high conductivity and strong reception and transmission signals.

PCB SMD Soldering Paste Flux Environmentally Friendly Lead-free Halogen-free Phone Repair BGA Flux Paste Liquid Solder