Высококачественная Бессвинцовая паяльная паста SAC305 для трафаретной печати SMT электронной пайки

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Specification




High Quality SAC305 Lead-free Solder Paste for Stencil Printing SMT Electronics Soldering


Specifications
Alloy Composition
Sn96.5Ag3.0Cu0.5
Halogen (W/F)
Halogen Free
Metal Content %
90±0.5 %
Powder Size
Type 3, Type 4 (Optional)
Flux Type
No-Clean
Viscosity Range
175 ± 30Pa/s
Expansion Rate
> 80%
Tin Bead Test
<3
Melting Point
217-227℃




Features of Tin Powder
1. Strict alloy material composition control and alloy manufacturing process, so that the raw materials are fully homogenized before being atomized into tin powder, reducing impurities, and the total impurity content does not exceed 1000 PPM.
2. The computer-controlled atomization process ensures the consistency and stability of various process indicators of the tin powder atomization atmosphere.
3. Strictly control the oxidation rate of tin powder, so that the total oxygen content is controlled within the range of Japanese Industrial Standards, and the oxygen content is low, which is less than 200 PPM.
4. Narrow particle size distribution, powder particle size diameter is small, good sphericity. Type 3, type 4, type 5 is available.






Advantage 1

Less Residue, higher insulation resistance


No-clean flux solder paste, after soldering, there is no residue at the surface of the stencil printing. It can keep a transparent appearance and high insulation resistance.



Advantage 2

Suitable viscosity, no collapse and excursion


By using our own formulated and lead-free soldering flux, our solder paste can keep very good thixotropic behavior and stable viscosity. Our solder paste also has excellent thermal collapse protection, it will provide quality guarantee for production.



Advantage 3

Excellent wettability, high tin climbing performance


The wettability and tin climbing properties will determine the soldering  quality. 

We have a powerful grinding machine, it can product different size of solder powder. Type 3, type 4, type 5 is available in different production requirements.




Advantage 4

Manufacture direct and dust-free plant


Our factory located in Shenzhen, China. We have our own factory to manufacturing solder wire, solder bar, and a separate solder paste plant which with dust-free working room. To make sure the products are pure and clean.

We have a cooperated biggest mine field provider in China, to ensure our stable and fresh raw material supply.



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