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Specifications | ||
Alloy Composition | Sn96.5Ag3.0Cu0.5 | |
Halogen (W/F) | Halogen Free | |
Metal Content % | 90±0.5 % | |
Powder Size | Type 3, Type 4 (Optional) | |
Flux Type | No-Clean | |
Viscosity Range | 175 ± 30Pa/s | |
Expansion Rate | > 80% | |
Tin Bead Test | <3 | |
Melting Point | 217-227℃ |
Less Residue, higher insulation resistance
No-clean flux solder paste, after soldering, there is no residue at the surface of the stencil printing. It can keep a transparent appearance and high insulation resistance.
Suitable viscosity, no collapse and excursion
By using our own formulated and lead-free soldering flux, our solder paste can keep very good thixotropic behavior and stable viscosity. Our solder paste also has excellent thermal collapse protection, it will provide quality guarantee for production.
Excellent wettability, high tin climbing performance
The wettability and tin climbing properties will determine the soldering quality.
We have a powerful grinding machine, it can product different size of solder powder. Type 3, type 4, type 5 is available in different production requirements.
Manufacture direct and dust-free plant
Our factory located in Shenzhen, China. We have our own factory to manufacturing solder wire, solder bar, and a separate solder paste plant which with dust-free working room. To make sure the products are pure and clean.
We have a cooperated biggest mine field provider in China, to ensure our stable and fresh raw material supply.
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