Нано углеродистая высокотеплопроводная алюминиевая фольга с покрытием для процессора PCB радиатор

Сохранить в закладки 1601093458847:


Цена:3 581,78 ₽ - 3 802,19 ₽*

Количество:

  • В избранное

Описание и отзывы

Характеристики


Nano Carbon High Thermal Conductivity Coated Aluminum Foil for CPU PCB Heatsink


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ItemHMR20050BHMR25050BHMR20050BHMR50050BHMR50100BHMR50130BHMR
100150B
Total thickness(mm)0.050.050.070.0850.10.130.15
Size(width X length)520mm*50M/100M (≤T0.04); 620mm*50M/100M (≤T0.05);
Substrate thickness(mm)0.0250.0250.020.050.050.050.1
AdhesiveAcrylic
ColourBlack
Tube core3.0’’(76.0)
Adhesion to Stainless seel(Kgf /25.4*25.4)≥1.0≥1.20≥1.20≥1.20≥1.50≥1.50≥1.50
Adhesion to Al foil(Kgf /25.4*25.4)≥1≥1.20≥1.20≥1.20≥1.50≥1.50≥1.50
Viscous force≥2#≥2#≥2#≥2#≥2#≥2#≥2#
hear Strength(1 inch)8H12H12H12H24H24H24H
Temperature resistanceLong Term (days, weeks)               80℃
Temperature resistanceShort Term (minutes, hours)             120℃
Surface resistanceNA
Base heat conductivity200 W/mk
Thermal conductivity of composite layer300~600 W/mk
UV ResistanceMedium
Shelf lifeForm 12 months from date of manufacture when stored in original cartons at 10-25℃and 30-70% relative humidity.

 


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1. For dimensional stability and improved handling with ease of die cutting and laminating;


2. The high adhesion adhesive provides excellent adhesion to a variety of surfaces;


3. High thermal conductivity, shielding , flexibility, machinability ,Temperature resistance properties;


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1. Intelligent mobile phone


2. Notebook computer


3. tachograph


4.Precision instrument


5.Other parts that need to conduct heat


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