The industry's first integrated vibration mirror cutting head to solve the problem of laser cutting energy control, realize semi-cutting, multi-level cutting to ensure that the bottom surface cutting has no mark;
* Develop high-performance software according to the customer's material characteristics, adjust the software parameters and quickly switch the processing application process to achieve the desired effect of the customer.
* Compatible with size and half-cut applications.
* The matrix flight cutting function is 20 times faster than the traditional trajectory cutting, and the vibrating mirror and the cutting head can run independently.
* The cutting head and vibration lens are integrated and can be switched freely, which can realize cutting, marking, sinking hole semi-transparent, and compatible with the cutting application of all non-metallic materials and die-cutting materials.
A. This equipment is a laser processing equipment that cuts non-metallic materials (PET, TPU, OCA, ITO, PMMA anti-seep film, etc.) into a specified shape with RF CO2 laser;
B. The equipment is a marble platform double-screw transmission structure, which specializes in serving high-end products. Adopt the two-drive synchronous design of the grinding-grade double-screw module, and configure a marble platform with a very small expansion coefficient to ensure the flatness and stability accuracy of the equipment;
C. For the characteristics of laser cutting products (producing smoke), install independent upper exhaust, follow the laser head cutting stroke to pull out the smoke throughout the whole process. To achieve smoke-free and odorless in the operation workshop, so that the operators can stay away from the previous laser cutting and suffer from odor and stench;
D. Laser cutting is based on the CAD drawing data imported into the equipment, adjusted to the most suitable processing condition parameters, and then start processing and production.
3. Equipment performance:
1. The computer drawing is transferred to the laser machine to complete the processing graphics required by DXF, and the equipment is formed and cut after debugging for different materials.
2. Operating speed of equipment: 100mm-500mm/s
3. Deep accuracy during molding: +/-0.03mm
4. Cutting accuracy: +/-0.06mm Repeat accuracy +/-0.01mm
5. Machining graphic radius: 2mm
6. Cutting method: the product is completely broken and half broken (two layers of products, the bottom film is continuous, and the surface of the product is completely broken)
7. A CO2 laser machine must be used to cut into a laser machine device with a set shape.
8. For different products, it can be equipped with CCD target capture function to achieve accurate positioning and cutting without manual positioning.
9. The processing method is imported into the equipment according to the CAD drawing data, adjusted to the most suitable processing condition parameters, and then start processing and production.
Final accuracy of equipment processing products: +/-0.06mm, thickness of processing materials: 0.1-3.0mm, effective processing area: 1480*680