Product DescriptionThe characteristics of resin method precision diamond cutting blade:
the use of the latest molding and sintering technology, with excellent self-sharpening, can greatly reduce the cutting resistance, achieve excellent cutting effect;The overall design has the most moderate toughness and hardness, with accurate thickness control, can be customized to meet the actual needs of customers.
Applications:
optical glass, quartz glass, CMOS imaging devices, filters, sound meter devices, semiconductor package, DFN, qFN,wafer-level packages and other precision electronic ceramics, alumina, aluminum nitride, piezoelectric ceramics, HTCC, PLCC, etc.