Высокопроводящий теплопроводный заполнитель с зазором силиконовые изоляционные прокладки электроизоляционные проводящие теплопроводящие гелевые

Сохранить в закладки 1601277961120:


Цена:27,56 ₽ - 99,19 ₽*

Количество:

  • В избранное

Описание и отзывы

Характеристики



Product Paramenters


Data Information
Unit
TSP015
TSP020
TSP025
TSP030
TSP0305
TSP040
Thickness
mm
0.15~10
0.15~10
0.15~10
0.3~10
0.3~10
0.5~5
Density
g/cc
2.1
2.3
2.7
2.9
3
3.1
Thermal Conductivity
W/m.k
1.5
2
2.5
3
3.5
4
Standard Hardness
Shore 00
40/60
40/60
40/60
40/60
40/60
40/60
Customized Hardness
Shore 00
10~90
10~90
10~90
20~90
20~90
30~90
Elongation Rate
50%
50%
40%
40%
30%
30%
Tensile Strength
psi
40
40
30
30
30
30
Flame Rating
UL 94
V-0
V-0
V-0
V-0
V-0
V-0
Working Temp.
-50~200
-50~200
-50~200
-50~200
-50~200
-50~200
Dielectric strength
kV/mm
>8
>8
>8
>8
>8
>8
Thermal Resistance
℃*in^2/W @30psi,1mm
0.9
0.7
0.5
0.45
0.45
0.4


Data Information
Unit
TSP050
TSP060
TSP070
TSP080
TSP0010
TSP0012
Thickness
mm
0.5~10
0.5~5
0.5~5
0.5~5
0.5~5
0.8~5
Density
g/cc
3.2
3.3
3.4
3.4
3.4
3.4
Thermal Conductivity
W/m.k
5
6
7
8
10
12
Standard Hardness
Shore 00
40/60
40/60
40/60
40/60
40/60
40/60
Customized Hardness
Shore 00
30~90
30~90
30~90
30~90
30~80
30~80
Elongation Rate
30%
30%
20%
15%
15%
15%
Tensile Strength
psi
30
30
20
20
10
10
Flame Rating
UL 94
V-0
V-0
V-0
V-0
V-0
V-0
Working Temp.
-50~200
-50~200
-50~150
-50~150
-50~125
-50~125
Dielectric strength
kV/mm
>8
>8
>6
>6
>6
>6
Thermal Resistance
℃*in^2/W @30psi,1mm
0.31
0.25
0.18
0.15
0.12
0.1




Product Advantage


TSP040 series thermal conductive silicon pad is high-performance, thermal conductive gap filling materials, mainly for the transmission heat between the electronic equipment and heat sink or product outer covering. Nice stickiness, flexibility, good compression performance and excellent heat conductivity are designed for TSP040 series,which make the products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect.


Customize Size/ Thickness /Shape /Back glue.

The size /thickness / shape / Back adhesion of the thermal silicone pad can be customized according to the customer's requirements



Typical Applications:

● Communication equipment
● LED Light
● Switching power supply
● Back light model
● Medical equipment
● Mobile equipment
● Video equipment
● Networking equipment
● Household appliances
● Note books





Useage steps :

Easy to install. The manufacturer is convenient for mass production and the delivery period is stable.

● The filling between PCB and heat sink

● The filling between IC and heat sink or product outer covering

● The filling between IC and heat sink or product outer covering





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