Фабрика Shenzhen производитель электронных печатных плат производство с файлами Gerber и BOM для розничного магазина
10,97 ₽ - 109,65 ₽
Сохранить в закладки 1601279359073:
Layer Count: | 1 to 32 layers |
Material Type: | CEM-1, FR4 (Grade A), High Frequency Boards, Aluminum Backed Boards, Copper Clad Boards, Flexible Printed Circuits (FPC), Rigid-Flex Boards, High Density Interconnect (HDI) Boards, and Specialty Boards, etc. |
Maximum Size: | FR4: 670mm x 600mm High-frequency Board: 590mm x 438mm Aluminum Backed Board: 602mm x 506mm Copper Clad Board: 480mm x 286mm |
Minimum Size: | Standard: 3mm x 3mm |
Thickness Range: | 0.4mm to 4.5mm |
Solder Mask Type: | Photosensitive Ink Green/ Purple/Red/Yellow/Blue/White/Black |
Half Hole Process: (1-1) | 1. Half hole diameter (Φ): ≥ 0.6mm 2. Distance from half hole edge to board edge (L): ≥ 1mm 3. Distance between half hole edges (D): ≥ 0.6mm 4. Minimum board size for single panel: 10mm x 10mm 5. Board thickness for half hole process: ≥ 0.6mm |
BGA: (1-2) | 1. BGA Pad Diameter: ≥ 0.25mm 2. Clearance from BGA Pad Edge to Trace Edge: ≥ 0.1mm (Minimum 0.09mm for Multilayer Boards) |
V-cutting: (1-3) | 1. Trace and Pad Clearance from Edge at V-Cutting: ≥ 0.4mm |
Service: (1-4) | One-stop PCB Manufacturing and Assembly Service: 1. PCB Design and Manufacturing 2. PCB Reverse Engineering (PCB Copying) 3. PCB Assembly (PCBA) 4. Electronic Components BOM Service 5. After-sales Technical Support |
Item | Capability |
Copper Thickness: | 1-6OZ |
Finished Board Thickness: | 0.2-7.0mm |
Min Hole Size: | Mechanical hole: 0.15mm Laser hole: 0.1mm |
Surface Treatment: | HASL, HASL lead free, Immersion Gold, Immersion Tin, lmmersion Silver, Hardgold, Flash gold, OSP... |
Outline Profile: | Rout/ V-cut/ Bridge/ Stamp hole |
Advantages: | 1. State-of-the-art Intelligent Management System and fully automated Smart Factory. 2. Expertise in Surface Mount Technology (SMT) and Through-hole Soldering, ensuring precision and reliability. 3. Rigorous testing through In-Circuit Test (ICT) and Functional Circuit Test (FCT) for unparalleled quality assurance. 4. Compliance with IPC, CCC, FCC, and RoHS standards in PCB Assembly, reflecting commitment to international best practices. 5. High-Standard SMT & Solder Assembly Line, optimized for efficiency and precision. 6. Advanced capability in High-Density Interconnect (HDI) board placement technology, catering to complex circuitry needs. |
Type of Assembly: | SMD, Through-hole, and mixed Assembly |
Solder Type: | Water Soluble Solder Paste, Leaded and Lead-Free |
File Formate: | Gerber files, Pick-N-Place file, Bill of Materials |
Testing: | Flying Probe Test,X-ray Inspection AOI Test, High-Low Temperature Testing, Drop Testing, Salt Spray Testing, Vibration Testing |
Новинки товаров от производителей по оптовым ценам