Паяльная паста паяльная батарея флюс канифоли сильный и легко припой желтый паяльник с проводимостью не содержит свинца
47,52-56,57 ₽
Алюминиевая паяльная паста 60 мл
- Категория: >>>
- Поставщик: Shenzhen Kewei Tin Industry Co. Ltd.Shenzhen Ltd.
Сохранить в закладки 1601330552906:
Описание и отзывы
Характеристики
Specifications
Specifications | ||
Alloy Composition | Sn62.8/Pb36.8/Ag0.4 | |
Metal Content % | 90±0.5 Weight% | |
Powder Size | 20~38um (Option) | |
Flux Type | RMA No-Clean | |
Viscosity Range | 190±30Pa/s | |
Expansion Rate | > 80% | |
Tin Bead Test | <3 | |
Melting Point | 178℃ | |
Products Description
Advantage 1.
Less Residue, higher insulation resistance.
With No-clean Flux, after soldering, there no residue at the surface of the product. Also can keep a transparent appearance and
high insulation resistance.
high insulation resistance.
Advantage 2.
Suitable viscosity, no collapse and excursion.
By using our own formula and environmental friendly soldering Flux, our solder paste can keep very good Thixotropic Behavior and
stable viscosity. Also our solder paste have excellent Thermal collapse protection, this will privide quality guarantee for
production.
stable viscosity. Also our solder paste have excellent Thermal collapse protection, this will privide quality guarantee for
production.
Advantage 3
Strong wettability, high Tin climbing performance.
The Wettability and Tin Climbing performace will decide the Soldering quality.
Also we have strong grinding machine, can provide different size Solder Powder. Diameter of the powder from 5μm~75μm available.
Suitbale for different kinds production requirements.
Also we have strong grinding machine, can provide different size Solder Powder. Diameter of the powder from 5μm~75μm available.
Suitbale for different kinds production requirements.
Advantage 4.
Directly manufacturer and dust-free plant.
Our factory lcated in Shenzhen-China, we have our own factory to manufacturing Soldering Wire/Solder Bar.
And also a separate Solder Paste plant which with Dust-free working room. To make sure the products are clean and purity.
Also we cooperate with the biggest mine field provider in China, to ensure our stable and fresh raw material supply.
And also a separate Solder Paste plant which with Dust-free working room. To make sure the products are clean and purity.
Also we cooperate with the biggest mine field provider in China, to ensure our stable and fresh raw material supply.
Applications
Solder Paste Applications.
Sn62.8/Pb36.8/Ag0.4 solder paste is widely used in PCB, BGA, CSP and welding repair. We have 2 types as low halogen and halogen
free . Can reach industry standards. With oxide layer for rapid removal of metal surface, components and storn metal bonding
performance, Non-conductive insulation, fast wetting, less smoke, less residue. We also prodcue many models such as high
temperature solder paste, low temperature solder paste, middle temperature solder paste, solder paste flux,
Tin lead solder paste, Sn63Pb37, Sn60Pb40, Sn50Pb50, Sn62.8Ag0.4Pb36.8, Sn62.9/Pb36.9/Ag0.2, lead free solder paste, low halogen
solder paste and halogen free solder paste, solder paste flux.
It is widely used for these: Laptop ,computer,mobile phone,home Appliances for LED, SMT, SMD, PCB industry ect.
free . Can reach industry standards. With oxide layer for rapid removal of metal surface, components and storn metal bonding
performance, Non-conductive insulation, fast wetting, less smoke, less residue. We also prodcue many models such as high
temperature solder paste, low temperature solder paste, middle temperature solder paste, solder paste flux,
Tin lead solder paste, Sn63Pb37, Sn60Pb40, Sn50Pb50, Sn62.8Ag0.4Pb36.8, Sn62.9/Pb36.9/Ag0.2, lead free solder paste, low halogen
solder paste and halogen free solder paste, solder paste flux.
It is widely used for these: Laptop ,computer,mobile phone,home Appliances for LED, SMT, SMD, PCB industry ect.
Instruction
Transport
For Solder Paste transportation, better by air. And the transport time better less than 5 weeks.
Begin Using.
Once get the solder paste, it should be kept at refrigerator and keep for 2~4 hours before begin normal production.
And solder paste removed from cold storage, do not open immediately, to prevent fogging, must be left at room temperature (2-4
hours) and the solder paste temperature back to 25 ℃ before open storage use.
And solder paste removed from cold storage, do not open immediately, to prevent fogging, must be left at room temperature (2-4
hours) and the solder paste temperature back to 25 ℃ before open storage use.
Storage.
After use, the solder paste must be stored in a clean and pollution-free empty bottle, sealed and stored in a cold storage, and
cannot be mixed with the new solder paste. The preservation period of the solder paste after opening is 6 days. If the storage
period exceeds 6 days, please discard it to ensure its production quality.
Also there is the Expiry Time with different temperature:
0-10℃: 6 months (Seal Storage)
>10℃: 15 days (Seal Storage)
After open: 6 days (Seal Storage)
cannot be mixed with the new solder paste. The preservation period of the solder paste after opening is 6 days. If the storage
period exceeds 6 days, please discard it to ensure its production quality.
Also there is the Expiry Time with different temperature:
0-10℃: 6 months (Seal Storage)
>10℃: 15 days (Seal Storage)
After open: 6 days (Seal Storage)
Attention.
Be infected with hands and feet carelessly, rinse with soap and water immediately, do not knead with hand, a few remain can be
swabbed with alcohol.
swabbed with alcohol.
Production Recomend
Printing Conditions.
Scraper | Hardness 80-90 degrees |
Sheet material | Stainless steel mesh mold or wire mesh |
material | Rubber or stainless steel |
The thickness of the sheet | Stainless steel formwork 0.12-0.25mm |
Scraper speed | 10-150 - mm/SEC |
Environment | Temperature: 25 ± 5L; Humidity: 40-60% RH |
Blade Angle | 60-90 |
The wind | will break the adhesive properties of the paste |
Reflow Oven.
Setting different temperatures based on different alloy and machines features. Also need to consider pcb layout, circuit width
then to adjust the processing temperature.
then to adjust the processing temperature.
Here are the recommended parameters for reflow oven.
(1)Ramp to Reflow: Ramp Speed set at 1℃~3℃/second, At preheating zone, if the temperature ramp to fast will break the solder
paste's mobility and components. This will arise Tin Blasting and tin ball problems.
(2)Preheating Zoon: Temperature better at 140~170℃, time at 80~150 seconds. If temperature is too low, there will make solder not
fully melting problem.
(3)Reflow: Peak Temp. Setting at 210℃~230℃. While Temp. ≥183℃, time set at 60~100 seconds. ≥200℃ set at 40~80 seconds.
(4)Cooling: Cooling Speed <4℃/second.
paste's mobility and components. This will arise Tin Blasting and tin ball problems.
(2)Preheating Zoon: Temperature better at 140~170℃, time at 80~150 seconds. If temperature is too low, there will make solder not
fully melting problem.
(3)Reflow: Peak Temp. Setting at 210℃~230℃. While Temp. ≥183℃, time set at 60~100 seconds. ≥200℃ set at 40~80 seconds.
(4)Cooling: Cooling Speed <4℃/second.
Company Profile
Shenzhen Kewei Tin Co., Ltd was built up since 2006. For over 13 Years' development, with advanced technical strength and complete product range, we are a mature solder product manufacturing enterprise and getting into the second biggest manufacturer in China. We have many automation equipment and high accuracy metal spectrum testing equipment, perfect management system and a number of senior technology R&D engineers. We provide high-quality solder products and related professional technical service for the modern high-tech electronics manufacturers and companies.
Pre-Sales Service
* Inquiry and consulting support.
* Sample testing support.
* View our Factory.
* Sample testing support.
* View our Factory.
After-Sales Service
* Product using suggestion for different products.
* Engineers available to service overseas.
* Problem shooting will reply responded within 2 hours.
* Engineers available to service overseas.
* Problem shooting will reply responded within 2 hours.
FAQ
Q1: Are you Manufacturer or Trader?
A: We are manufacturer for over 13 years experiences.
Q2. Can I have a sample order for Solder Bar?
A: Yes, we welcome sample order to test and check quality. Mixed samples are acceptable.
Q3. What about the lead time?
A:Sample needs only 1 day, mass production time needs 1-2 days for order quantity more than 500Kg.
Q4. Do you have any MOQ limit for sample order?
A: There is no MOQ.
Q5. How do you ship the goods and how long does it take to arrive?
A: For Sample order usually ship by DHL, UPS, FedEx or TNT. It usually takes 3-5 days to arrive. Airline and sea shipping also
optional for formal order.
Q6. Is it OK to print my logo on the Solder Bar/ Package?
A: Yes. Please inform us formally before our production and confirm the design firstly based on our sample.
A: We are manufacturer for over 13 years experiences.
Q2. Can I have a sample order for Solder Bar?
A: Yes, we welcome sample order to test and check quality. Mixed samples are acceptable.
Q3. What about the lead time?
A:Sample needs only 1 day, mass production time needs 1-2 days for order quantity more than 500Kg.
Q4. Do you have any MOQ limit for sample order?
A: There is no MOQ.
Q5. How do you ship the goods and how long does it take to arrive?
A: For Sample order usually ship by DHL, UPS, FedEx or TNT. It usually takes 3-5 days to arrive. Airline and sea shipping also
optional for formal order.
Q6. Is it OK to print my logo on the Solder Bar/ Package?
A: Yes. Please inform us formally before our production and confirm the design firstly based on our sample.
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