Оборудование для производства электроники

Сохранить в закладки 1601332610422:


Цена:26 999,00-32 999,00 $*

Количество:

  • В избранное

Описание и отзывы

Характеристики



Application Domain




Product Description




Power supply
AC 110V/220V 50/60Hz
Total power
Max 1600W
Heater power
Tube current 10-89uA
Locating way
V shape slot,PCB support jigs can adjust,laser light do fast centering and position
Temperature controlling
(high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1℃
Electrical material
Driving motor+ smart temp.controller+color touch screen
Computer
DELL Windows10
Tin spot monitoring
Optional external camera to monitor solder ball melting process during welding
Camera in and out
Auto out & in
Overall dimension
L600×W640×H850mm
Operation mode
5 working modes. Auto/ manual mode switch freely
Weight
1500KG


Detailed Images



Independent 3 heating zones temperature control system 
1.Automatically pick up and replace chips;
2.Built-in pressure testing device,can detect pressure of     0.8g.While the testing device detect the pressure,the   machine head will stop falling automatically to protect   PCB from being crushed;
3.Different sizes of vacuum sucker work for different sizes   of chip.


High-temp resistance Nanoscale IR heating tube
1.Prevent IC chip from being dropped and burnt
2.Infrared heating is more easily absorbed by PCB
3.More effectively prevent PCB from defomation,make   heating more evenly


Sensitive MCGS touch screen


1.7〃HD Touch Screen

2. Resolution:800*480 

3. Multi storage 5000+ temperature profiles for different chip;
4.Display set and practical temperature;
5.English,Spanish,French and other     languages are available.




1. 8 segments of temperature  up/down and 8 segments of constant temperature control,mass storage of temperatures,analyze curve.
2. Set different temperature for different chip.Same and similar PCB use same profile. Time-saving.



Precise CCD optical alignment system
1. 15〃Color HD LCD display
2. 8 million pixels
3. Mounting accurancy within 0.01mm
4. Shows the image of every soldering joint,increase the repair success rate.
5. Yellow point is the soldering point on PCB,blue point is the soldering point on BGA chip.


Second heating zone height adjust
Distance between PCB and nozzles can be adjusted withi this rotary handel,suitable distance is 2-3mm
 ♦ Heating zone adjust  switch
Can switch off the heating plate on both sides if the motherboard is small
♦ Laser position
Location the chip fast

♦HD camera contrl

Controlled by motor to in/out

♦ Micrometer
1.Slightly adjust angel of chip for precise alignment
2.Mounting accuracy within 0.01mm
3.Effectively increase success rate of repairing 
♦ K-sensor 
Test the temperature to get the accurate heating profile



Packing & Delivery



Package

1,Standard export wooden package for bga rework station:70*81*90cm,105KG;

2,Delivery in 2 workdays after payment confirm;                

3,Shipping by TNT, UPS ,DHL,FEDEX, EMS or by air ;

4,Loading port: Shenzhen or Hongkong.



Why Choose Us



● We are manufacturer = own factory+ machine design+sheet metal produced by ourselves+spray the powder+
strong assemble the machine team + packaging+free training
● Rich experience in BGA rework station field
● Develop new products to meet different requirements based on customer feedback
● Provide OEM services
● 100% NEW from WDS factory
● Have excellent teams and focus on product development & design, quality control & inspection
● Good reputation both at home and abroad



Business Partners








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