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Product features: |
1. The core module uses the HC-06 slave module, and the lead-out interface includes VCC, GND, TXD, RXD, and a reserved LED status output pin. The microcontroller can determine whether the Bluetooth is connected through the pin status. The KEY pin is invalid for the slave |
2. The LED indicates the Bluetooth connection status. Flashing means no Bluetooth connection, and constant light means that the Bluetooth is connected and the port is open |
3. The baseboard is 3.3V LDO, the input voltage is 3.6~6V, the current is about 30mA when not paired, and about 10mA after pairing. The input voltage is prohibited to exceed 7V! |
4. The interface level is 3.3V, which can be directly connected to various microcontrollers (51, AVR, PIC, ARM, MSP430, etc.), and 5V microcontrollers can also be directly connected. No MAX232 is required and cannot pass through MAX232! |
5. The effective distance in open space is 10 meters. It is possible to exceed 10 meters, but the connection quality at this distance is not guaranteed. |
6. After pairing, it is used as a full-duplex serial port. There is no need to understand any Bluetooth protocol, but it only supports 8 data bits, 1 stop bit, and no parity communication format. This is also a commonly used communication format. Other formats are not supported. |
7. When the Bluetooth connection is not established, it supports setting the baud rate, name, and pairing password through AT commands. The set parameters are saved after power failure. After the Bluetooth connection is established, it automatically switches to transparent transmission mode. |
8. Small size (3.57cm*1.52cm), factory patch production, guaranteed patch quality. And set transparent heat shrink tube, dustproof and beautiful, and has a certain anti-static ability. |
9. The link is a slave. The slave can be paired with various Bluetooth-enabled computers, Bluetooth hosts, most Bluetooth-enabled mobile phones, PDAs, PSPs and other smart terminals. Slaves cannot be paired with each other. |
PCB Assembly Capability | ||
Item | Capability | |
Advantages | ----Professional Surface-mounting and Through-hole soldering technology | |
----Various sizes like 1206,0805,0603 components SMT technology | ||
----ICT(In Circuit Test),FCT(Functional Circuit Test) | ||
----PCB Assembly With UL,CE,FCC,Rohs Approval | ||
----Nitrogen gas reflow soldering technology for SMT. | ||
----High Standard SMT&Solder Assembly Line | ||
----High density interconnected board placement technology capacity. | ||
Components | Passive Down to 0201 size | |
BGA and VFBGA | ||
Leadless Chip Carriers/CSP | ||
Double-sided SMT Assembly | ||
Fine Pitch to 0.8mils | ||
BGA Repair and Reball | ||
Part Removal and Replacement | ||
Quantity | Prototype & Low Volume PCB Assembly,from 1 Board to 250, or up to 1000 and customized | |
Type of Assembly | SMT, Thru-hole | |
Solder Type | Water Soluble Solder Paste, Leaded and Lead-Free | |
Bare Board Size | Smallest:0.25*0.25 inches | |
Largest:20*20 inches | ||
File Formate | Gerber files, Pick-N-Place file, Bill of Materials | |
Types of Service | Turn-key,partial turn-key or consignment | |
Component packaging | Cut Tape,Tube,Reels,Loose Parts | |
Turn Time | Same day service to 15 days service | |
Testing | Flying Probe Test,X-ray Inspection AOI Test | |
PCB assembly process | Drilling----Exposure-----Plating-----Etaching & Stripping---Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling---- ICT-----Function Testing-----Temperature & Humidity Testing |
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