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1 | Large standard product for thermal conductive pastes and glues, silicone-, GEL-, and foam foils (Gap Filler),cuts, tapes, tubes and caps |
2 | Thermal conductive electrically insulating foils, |
3 | customer specific productions made in our in-house punching shop |
X23-7783D, is a thermal interface material developed and manufactured by Shin-Etsu Chemical with ease of applicati on in mind. Specifi cally formulated to include an applicati on chemical to allow ease of screening and other applicati on techniques. With a higher Thermal Conducti vity coupled with lower Thermal Resistance exceeds thermal management requirements of high-performance semiconductor devices. Through superior heat dissipati on, the X23 -7783D allows electronic devices to remain cooler and increases their long term reliability.
Our product range contains devices and complete cooling systems for dissipating semi-conductors as well as heatsink direct from the manufacturer.Furthermore we offer various extruded case for aluminum and Extruded profiles for
aluminum in different designs,In the area of cases especially our modern design cases are convincing.
Direct: +86 769 8182 2159
Tel: +86 769 8182 2158 Ext.8028
Mobile: +86 189 9808 5269
E-mail: donny.wu(@)renxin-precision.com
Website: //www.renxin-precision.com
Address: No.30Weijian Road, Zone E,Weijian Industrial Park, Chashan Town, Dongguan City, Guangdong Province, China
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