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Newest Technical Laser Separating Machine Back Glass Removal Laser Cutting Machine for Phone
Function
1. 1)Laser Machine for Midframe/Bezel/Back glass Separate;
2)Marking/Engraving
2.Technology Upgrading----Intelligent Ranging System
3. Easy operation, Come with Software and drawings(Continuous updating...)
4. Suitable for all touch screen smart phones Laser Repair in the market: for IPhone, Huawei, XiaoMi,OPPO,vivo,LG
Specification:
Product Name :Laser Separating Machine Model:PG oneS Laser power:20W Machine power:≤ 800W Marking speed::≤10000mm/s Marking power:≤0.001MM Cooling method: built-in air cooling Laser wavelength :.06μm Laser equipment size:400*520*635mm Power supply:220V ± 10%, 50HZ ± 5% Ambient temperature: -10 ° C ~ 65 ° C Repeatability:≤0.001mm Marking depth: 0.015-0.5mm Marking range:175*175mm Marking line width: 0.05-0.01mm Equipment weight: 21.2kg Machine Size: 300*538*588.5mm Gross weight: 32kg |
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