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T-835 BGA Portable Infrared Heating Rework Desoldering Station 220V/110V For Phones Computers Notebooks Soldering Unsolder
1. Adopt hand-held lamp structure with flexible operation and easy control. T835 is suitable for any points of a flat component, especially BGA, SMD components. 2. Use infrared heat lamp. Heat is easy to pierce and distribute evenly, which overcome disadvantages (burn out elements) of traditional welder machines. 3. Infrared heating don't have sirocco flow. Don't impact circumjacent small elements. It is suitable for all of the elements. It can be used to unsolder BGA, SMD, CSP, LGA, QFP and PLCC, especially Micro BGA and SMD elements. 4. Easy operation. you can operation it skillfully. Don't need any welding tools. This machine can solder all the flat components. 5. T-835 will satisfy soldering/unsoldering of phones, computers, notebooks, Game machines, etc
model | T-835 |
power | 300W |
lamp temperature(°C) | 0-350 |
chip size(mm) | 35*35-50*50 |
Effective welding size(mm) | 35*35cm |
1*machine
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