Экономичная компактная волновая паяльная машина LF230A/Автоматические компоненты для пайки

Сохранить в закладки 879481314:


Цена:2 580,00 $ - 3 850,00 $*

Количество:

  • В избранное

Описание и отзывы

Характеристики


 

Product Description

 

Lead Free bench top compact wave soldering machine, low capacity titanium solder pot of 85kg, high performance shot light preheat and reliable foam flux.

 

PCB size 200mm ( Width ) x 260mm ( Length ) with output approx 200 boards per 8 hours .

 

Features

 

1 Easy operation and control;

 

2 Solder temperature and time are digital display on the controlling panel;

 

3 High temperature heat elements are in the machine to ensure wave solder stable performance and best reliability.

 

4 Wave solder machines with bench top and lead free are widely application. The unit has replaced iron and dip solder furnace to do soldering in small-middle batch production.

 

5 PCB productions are up to 200 pcs within 8 hours, high efficiency in university, research and design factory.

 

High efficiency: Reasonable price, long life Small size and low power consumption.

 

6 Titanium pot for lead free soldering is advance and environmental; Long use life and best price;

 

7 Small dimension, saving space, the best choice for research and low volume production.

 

 

Adjustable Titanium Finger Conveyor

 

Adjustable carrier, with titanium fingers on pallet automatically indexes boards on chain-drive conveyor.

Pallets are available for Multi-piece small boards to process soldering.

 

wave solder small.jpg

 

                     

 

Foam Flux

 

Integrated automatically activated foam flux with adjustable wave height.

 

wave solder desktop.jpg

 

 

Whole soldering process

 

PCB boards move downward to flux and preheat, then it will reverse to solder and cool-down. The board wave soldering is completed and load new board.

small wave solder 1.jpg

wave solder machine 230awave soldering machine LF230ABenchtop wave soldering machinewave soldering table topsmall wave soldering machine LF230A

 

 

Technical parameters

 

Specification

 

Model

Bench top lead free wave LF230

Max power consumption

3Kw

Solder pot capacity

40--85Kg (make by order)

PCB Size

200 * 260 mm (It can be made by order)

Solder temperature range

Room~300°C adjustable

Preheat Temperature range

90~130 °C

Wave height adjust range

5~ 12mm

Melt time

60min

Flux spray

Foam spray

Power supply

AC 220V 50HZ

Conveyor speed

0.5~ 2 m /min

Dimension

900 * 668* 580mm

Weight

Approx 110kg

Packing

Exemption wooden packing

Packing size

L110* W800 * H700mm                                        


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