8-Layer Electronics 3 Oz Copper Base Multilayer Rigid PCB

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Product Overview


If desired, we will source, organise and manage all aspects of the PCB design, so that your product meets all required standards and is fully optimised for easy and cost effective manufacturing.

A well designed circuit board means:
· A reduction in production problems
· Improved quality control
· Reduced costs
· Reduced manufacturing times
We work to supply small and large batches of competitively priced printed circuit boards to our customers.

PCB&PCBA Capabilitise

PCB Capability
Number of Layer
1 - 20 Layer
Maximum Processing Area
680 × 1000MM

Min Board Thickness
2 Layer - 0.3MM ( 12 mil )
4 Layer - 0.4MM ( 16 mil )
6 Layer - 0.8MM ( 32 mil )
8 Layer - 1.0MM ( 40 mil)
10 Layer - 1.1MM ( 44 mil )
12 Layer - 1.3MM ( 52 mil )
14 Layer - 1.5MM ( 59 mil )
16 Layer - 1.6MM ( 63 mil )
18 Layer - 1.8MM ( 71 mil )
Finished Board Thickness Tolerance
Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending
≤ 0.75%, Min: 0.5%
Range of TG
130 - 215 ℃
Impedance Tolerance
± 10%, Min: ± 5%
Hi-Pot Test
Max: 4000V/10MA/60S

Surface Treatment
HASL, With Lead, HASL Free Lead
Flash Gold, Immersion Gold
Immersion Silver, Immersion Tin
Gold Finger, OSP

PCB Assembly Capability
PCB Assembly Capability
Order Quantity
1pc – 10,000,000+pcs
Build Time
1 – 5 days, 1 – 2 weeks, or scheduled deliveries
PCB Spec Requirements
PCB whose width/length is less than 30mm should be panelized
Max board size: 500×450 mm
Board Type: Rigid PCBs, Flexible PCBs, Metal core PCBs
Surface finish: lead/lead-free HASL, ENIG, Silver, OSP
Assembly Types
Surface mount
Mixed technology (SMT & Thru-hole)
Single or double sided placement
Conformal coating
Shield cover assembly for EMI emission control
Solder Type
Lead-free – RoHS
Parts Procurement
Full Turnkey
Partial Turnkey
Component types
SMT 01005 or larger
BGA 0.4mm pitch, POP (Package on Package)
WLCSP 0.35mm pitch
Hard metric connectors
Cable & wire
SMT Parts Presentation
Cut tape
Partial reel
Laser-cut stainless steel
Other Techniques
Free DFM Review
Box Build Assembly
100% AOI test and X-ray test for BGA
IC programming
Components cost-down
Function test as custom
Protection technology

It can be a challenge to find the optimal supplier for PCBs – meeting each and all customers’ expectations and requirements on price, quality, lead times, value-added services, and delivery. Wonderful PCBs is confidant that we meet each and every expectations for your each PCB.

Production Flow

Our advantage
Material Technology
Our Production
General Production
1.Our (TG170)FR4:
high quality materials, excellent heat resistance, won't distort break in high temperature, no foaming, no burning, good
performance in electrical charge, impact resistance, humidity-resistance

2.Our FR4
good performance in electrical charge, impact resistance, humidity-resistance

3.Our CEM

4.Our Rogers
Good performance in high frequency

5.Our Aluminum
Excellent heat dispersion
1.General FR4
High heat work

2.General CEM
Expand and deform in damp conditions
We have automatic production line. The automatic production line improves the precision and efficiency of PCB producing,it makes
surface brighter, cleaner and more smooth, and it helps reduce the cost.
Artificial production line
Blind/buried via board, High Density Interconnect(1+1,N+1)
Application of HDI technology reducing the thickness and the volume of PCB boards, increasing the density of 3-D wiring design.
Difficult manufacturer, high cost
Good performance in reliability and stability of signal sending and receiving
High cost
Surface Technics
1.IMG:smooth surface, good adhesion, no oxidation under long using
2.gold plating(thick gold:1-50U"):good wear-resistance
3.HASL:better price, not easy oxidation, easy to welding, smooth surface
4.HAL: better price, not easy oxidation, easy to welding
1.IMG:high price
2.Gold plating(thick gold):high price
3.HAL:surface is not flat, not suitable for BAG packaging
Copper Via/Surface(20-25UM,0.5-60Z)
Laser holing: Min 0.1MM, Mechanical holing: Min 0.2MM
Hard to reach 0.1MM
Multilayer board(4-20 L),BGA(CPU)
BGA:high density, high performance, multifunctional, increase thermal reliability, good performance in electroheat property, MIN
width/space: 3/3MIL

Multilayer board:strong microporous, high reliability
Difficult manufacturer,high cost
To assure quality, avoid wasting after installing and scraping, save cost, save the time of rework

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