Aviation instrument circuit board pcb two-layer printed circuit prototype board PCB factory

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Product Overview

Description




Complete industrial facilities

● Advanced production equipment;
High-quality engineering and technical personnel,
30,000 square meters production line.
Self-built industrial park, so the manufacturing cost is more advantageous



Production Quality Assurance

Timely and reasonable plan
Professional and responsible quality management team
The manufacturing process of keeping improving
Enthusiastic and active service personnel



Company Introduction
Our products include single sided board, double-sided board and multi-layer circuit boards, which are widely used in automobiles,industrial control, LED lighting, computers, medical treatment, communication, aviation, instrumentation, Bluetooth headset modules, microelectronics, automation control and other scientific and technological fields.

And has established extensive business contacts with many electronic manufacturers in Hong Kong and Taiwan, mainland, UnitedStates, Japan and Southeast Asia, which has won deep praise from customers, in addition, Heng has considerable popularity in themarket and has become a long-term designated circuit board service provider for many large manufacturers.

With 30000 square meters of factory buildings and modern production lines, it can professionally produce two to twenty layers of high-quality circuit boards with a monthly output of 30,000 square meters.




Power control board

【Copper thickness】:2/2 OZ
【Plate type】: FR4 TG170
【plate thickness】:2.0mm
【Minimum aperture】:0.2mm
Minimum line width and line spacing】:0.15mm
【Surface treatment】:ENIG
【Layers】:16
Gold thick2U"
Test standard】:IPC-3
Impedance】:55Ω
Special craft】:Blind hole
【BGA】:0.4mm
Vertical and horizontal ratio】:10:1
Test point】:15000



QUALITY

The quality of fine energy-saving products is derived from professional technical support.

CRAFT

The technological ability will directly affect the product quality, and it is also the embodiment of the company's strength.

PLAN

The plan is a rigorous work, and the specific and comprehensive plan is the foundation to ensure the delivery date of customers'products.






No
Item
Process capability
1
Number of layer
1-20 Layers(standard)
2
Surface finish
HASL,Gold plating,Immersion gold,Solder coating,OSP
3
Material
FR4,Aluminum
4
Finish board thickness
0.2mm-3.2mm
5
Copper Thickness
1/2oz ; 12oz
6
Solder Mask
Green,Black,White,Red,Blue,Yellow,Matte Black
7
Min.Trace Width & Line Spacing
0.075mm/0.1mm
8
Min.Hole Diameter for CNC Driling
0.1mm
9
Biggest panel size
720mm*540mm
10
Hole Positon
±0.075mm
11
Hole Diameter(H)
PTH L:±0.075mm;Non-PTH L:±0.05mm
12
Outline Tolerance
0.10mm CNC Routing;±0.10mm by punching
13
Warp & Twist
0.70%
14
Insulation Resistance
10KΩ-20MΩ
15
Conductivity
< 50Ω
16
Test Voltage
10-300V
17
Layer-layer misregistration
4 layers:0.15mm;6 layers:0.2mm
18
Minspacing between hole edge to circuity pattern of an inner layer
0.15mm
19
Minspacing between board ouline to circuitry pattern of an inner layer
0.15mm
20
Board thickness tolerance
4 layers:±0.13mm;6 layers:±0.15mm
21
Impedance control
±10%
22
Different Impendance
±10%


Manufacturing process




Quality assurance
Strictly grasp the quality of raw materials, track the whole production process, and give you better protection of products.


Flying probe/test rack inspection
Apply KINGBOARD copper clad laminate
Better protect your products




Gold sinking process

The purpose of gold deposition process is to deposit nickel gold coating with stable color, good brightness, flat coating and good
solderability on the stool surface of circuit board. It can be divided into four stages:
pre-treatment, nickel precipitation, gold
precipitation and post-treatment.




Gold plating process
Vertical hot air solder leveling process is difficult to blow the thin welding plate flat, which brings difficulty to SMT mounting:
In addition, the service life of the tin spraying plate is very short, and the gold plating plate just solves this problem.






Solder coating process
Solder coating also known as hot air leveling. The function is to prevent oxidation of bare copper surface and maintain solder
performance.
The quality of solder coating directly affects the welding quality of customers during subsequent production.





OSP
It is used to protect the copper surface from oxidation or vulcanization in normal environment. However, in the subsequent weldinghigh temperature,
this protective film must be easily removed by scaling powder.



Our honor






0.0098 s.