Original design standard manufacture package semiconductor device

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Product Overview

Description





Products Description




Spring-loaded trays

The Super Tray was born to solve the problems of the past.
■ Customization according to field and application
■ Proprietary spring-loaded structure enables high-precision batch fixing and releasing.
■ Vacuum deposition, printing, inspection and assembly are possible within the tray
■ Reverse operation is supported
■ Improved production efficiency due to increased filling rate
■ Full support from design to realization of original standard products
Applications: laser marking, solder printing, screen printing, die bonding, wire bonding and more!


Product name
Spring-loaded trays
Brand Name
UPT
Place of Origin
Japan






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Company Profile






To serve society with first-rate high precision products,
UPT is supporting global leading companies in electronics,
semiconductor related and other industries.

■Smaller, finer, and thinner than anywhere else
We offer etching processes at a thickness of 0.004 mm (among the thinnest in the world).
■Wide range of supported materials and hardness
Make your selection based on the desired specifications, such as spring load or conductive qualities.
■High quality × low cost × short delivery time
Prototypes delivered as fast as 3 days. Low-cost mass production with Japanese-built quality is also possible.
■Responsive support
Wide-ranging consultation and support for customer needs from specialists in every field.




0.1867 s.