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Fibocom L860-GL module Specifications: * Chipset: Intel XMM7560 * LTE FDD:LTE FDD: Band 1, 2, 3, 4, 5, 7, 8, 12, 13, 14, 17, 18, 19, 20, 21, 25, 26, 28, 29, 30, 32, 66 * LTE TDD: B38/39/40/41/42 * UMTS: Band 1, 2, 4, 5, 8 * Form factor: M.2 package * Dimensions: 30.0*42.0*2.3 mm * DL 5CA on 4 bands, DL 256QAM support * DL-MIMO: 2*2, 4*2, 4*4 * DL 4x4 MIMO: Band 1,2,3,4,7,30,40,41NB, 66 * LAA(Band 46) * Integrated GNSS * eSIM interface support * Operating Voltage: 3.135V~4.4V, Typical 3.3V * Operating Temperature: -10~+55°C * Storage Temperature: -40~+85°C * AT Command Set: 3GPP TS 27.007 and 27.005, proprietary FIBOCOM AT commands * TX Power: - FDD& TDD LTE: 23dBm - WCDMA: 23.5dBm * RX Sensitivity: FDD& TDD LTE: -98dBm~102dBm * Data - FDD& TDD LTE: 1Gbps DL(Cat 16), 150Mbps - UL(Cat 13, 2CA on intra bands) - UMTS/HSPA+: 42Mbps DL(Cat 24), 11.5Mbps - UL(Cat 7) * Interface - USIM: 3V/1.8V - PCIe - BodySar * Driver: Windows 10 and Linux * Approval: - CE / CCC / FCC / GCF / PTCRB etc. 100+ countries certification - AT&T / Verizon /Sprint / DT / Telefonica / Vodafone /Swisscom / Docomo / KDDI / Softbank / Telstra /Optus | ||





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