Share on:
Specification: | ||||||||
PCB layers: | 1-24layers | |||||||
PCB materials: | CEM1, CEM3, Teflon, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free | |||||||
PCB max. board size: | 620*1100mm | |||||||
PCB certificate: | RoHS Directive-Compliant | |||||||
PCB Thickness: | 1.6 ±0.1mm | |||||||
Out Layer Copper Thickness: | 0.5-5oz | |||||||
Inner Layer Copper Thickness: | 0.5-4oz | |||||||
PCB max. board thickness: | 6.0mm | |||||||
Minimum Hole Size: | 0.20mm | |||||||
Minimum Line Width/Space: | 3/3mil | |||||||
Min. S/M Pitch: | 0.1mm(4mil) | |||||||
Plate Thickness and Aperture Ratio : | 30:1 | |||||||
Minimum Hole Copper: | 20µm | |||||||
Hole Dia. Tolerance(PTH): | ±0.075mm(3mil) | |||||||
Hole dia. Tolerance(NPTH): | ±0.05mm (2mil) | |||||||
Hole Position Deviation: | ±0.05mm (2mil) | |||||||
Outline Tolerance: | ±0.05mm (2mil) | |||||||
PCB surface finished: | HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver | |||||||
PCB solder mask: | Black, white, yellow | |||||||
Legend: | White | |||||||
E-test: | 100% AOI, X-ray, Flying probe test. | |||||||
Outline: | Rout and Score/V-cut | |||||||
Inspection Standard: | IPC-A-610CCLASSII | |||||||
Certificates: | UL (E503048),ISO9001/ISO14001/IATF16949 | |||||||
Outgoing Reports: | Final Inspection, E-test, Solderability Test, Micro Section and More |
PCB Assembly OEM Service | ||||||||
Electronic Components Material Purchasing | ||||||||
Bare PCB Fabrication | ||||||||
Cable, Wire-harness Assembly, Sheet Metal, Electrical Cabinet Assembly Service | ||||||||
PCB Assembly Service: SMT, BGA, DIP | ||||||||
PCBA test:AOI, In-Circuit Test (ICT), Functioal Test (FCT) | ||||||||
Conformal Coating Service | ||||||||
Prototyping and Mass Production |
PCBA ODM service | ||||||||
PCB Layout, PCBA Design According To Your Idea | ||||||||
PCBA Copy/Clone | ||||||||
Digital Circuit Design / Analog Circuit Design/ lRF Design /Embedded Software Design | ||||||||
Firmware and Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming | ||||||||
Embedded User Interface Design / lSystem Hardware Design |
Specification: | ||||||||
PCB layers: | 1-24layers | |||||||
PCB materials: | CEM1, CEM3, Teflon, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free | |||||||
PCB max. board size: | 620*1100mm | |||||||
PCB certificate: | RoHS Directive-Compliant | |||||||
PCB Thickness: | 1.6 ±0.1mm | |||||||
Out Layer Copper Thickness: | 0.5-5oz | |||||||
Inner Layer Copper Thickness: | 0.5-4oz | |||||||
PCB max. board thickness: | 6.0mm | |||||||
Minimum Hole Size: | 0.20mm | |||||||
Minimum Line Width/Space: | 3/3mil | |||||||
Min. S/M Pitch: | 0.1mm(4mil) | |||||||
Plate Thickness and Aperture Ratio : | 30:1 | |||||||
Minimum Hole Copper: | 20µm | |||||||
Hole Dia. Tolerance(PTH): | ±0.075mm(3mil) | |||||||
Hole dia. Tolerance(NPTH): | ±0.05mm (2mil) | |||||||
Hole Position Deviation: | ±0.05mm (2mil) | |||||||
Outline Tolerance: | ±0.05mm (2mil) | |||||||
PCB surface finished: | HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver | |||||||
PCB solder mask: | Black, white, yellow | |||||||
Legend: | White | |||||||
E-test: | 100% AOI, X-ray, Flying probe test. | |||||||
Outline: | Rout and Score/V-cut | |||||||
Inspection Standard: | IPC-A-610CCLASSII | |||||||
Certificates: | UL (E503048),ISO9001/ISO14001/IATF16949 | |||||||
Outgoing Reports: | Final Inspection, E-test, Solderability Test, Micro Section and More |
PCB Assembly OEM Service | ||||||||
Electronic Components Material Purchasing | ||||||||
Bare PCB Fabrication | ||||||||
Cable, Wire-harness Assembly, Sheet Metal, Electrical Cabinet Assembly Service | ||||||||
PCB Assembly Service: SMT, BGA, DIP | ||||||||
PCBA test:AOI, In-Circuit Test (ICT), Functioal Test (FCT) | ||||||||
Conformal Coating Service | ||||||||
Prototyping and Mass Production |
PCBA ODM service | ||||||||
PCB Layout, PCBA Design According To Your Idea | ||||||||
PCBA Copy/Clone | ||||||||
Digital Circuit Design / Analog Circuit Design/ lRF Design /Embedded Software Design | ||||||||
Firmware and Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming | ||||||||
Embedded User Interface Design / lSystem Hardware Design |