Factory supplier ultrasonic automatic wire bonding machine for LED lab wire bonding machine

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Product Overview

Description



Product Description


Heavy wire bonder
Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder.
The most competitive 4 types: thin aluminum wire wedge bonder XW-B2575(25-75um aluminum wire);Wire wedge bonder
XW-B25125(25-125um aluminum wire); heavy aluminum wire wedge bonder XW-B7550(75-500um aluminum wire);gold wire ball bonder
XW-B1750(17-50um gold wire). they are very popular for small quantity production, school, institution, research department.
And the 3 automatic: automatic thin aluminum wire bonder XW-Etech1850(18-50um aluminum wire); automatic ball bonder
XW-S800(15-50um Au or alloy wire); automatic heavy wire bonder XW-CWX-3710(125-500um Aluminum wire).


Specification


electric requiement:
220VAC±10%、50HZ、be sure connected to ground
aluminium wire diameter:
75~500μm (3~20mil)
ultrasonic power:
0-30W, two channel.can be set separately of the two point
bond time:
10-500ms,two channel
bond force:
30-1200g,two channel
motorized Y:
0-18mm
microscope rate:
7.5 and 15
working area:
Φ25mm
light:
adjustable brightness
size:
620×610×560mm
35weight:
35kg


Sample




Applications


High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment, wire bonding,TO-3、TO-3P、TO-3PF、TO-3PN、TO-3PL、TO-220F、TO-126、TO-12F、TO-66、TO-251、TO-202 etc.



Packing & Delivery




To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.


0.2262 s.