Custom 1A1 Surface Grinding Ceramic Diamond wheel For Grinding Diamond Composite Wafers And Semiconductor Silicon Wafers

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Price:$138.00-175.00

Quantity:


Product Overview

Description








1A1 Surface Grinding Ceramic Diamond wheel For Grinding Diamond Composite Wafers And Semiconductor Silicon Wafers


















Product Advantages







1. High strength
2. Good heat resistance
3. Sharp cutting
4. High grinding efficiency
5. High wear resistance
6. Low grinding force
7. Low grinding temperature
8. High precision, good surface quality
9. Good shape retention
10. Wide application range







Application







Vitrified bond diamond grinding wheel is suitable for grinding PDC cutter, PCD, PCBN cutting tools, natural diamond cutting tools,various hard alloys, ceramics, glass, jewelry, Molds, tools, precision grinding processing, metal ceramics.







Product Information




























Size


100mm/110mm/125mm/150mm/200mm/250mm/350mm/400mm


Rough Grinding


W14 W28 W40


Fine Grinding


W10


Finishing


W5/W3.5



Special specifications and specify grit size can be customized according to customer requirements.



 





SAISU & Delivery







1.we could ship by Commercial Express,like UPS,DHL,FedEx,Aramex,we could also ship byair/by sea/by land as your request.
2. A tracking number will be updated within two working days once your order is shipped. 
3. We are not responsible for any customs charges, taxes,or fee. For any details please contact your local customs office. 
4. If you have not received your parcel, please contact us immediately for help. We will reply the email within 24 hours. 
NOTICE: Holidays and weekends are not included in working days.







0.1621 s.