1A1 Surface Grinding Ceramic Diamond wheel For Grinding Diamond Composite Wafers And Semiconductor Silicon Wafers
Product Advantages
1. High strength 2. Good heat resistance 3. Sharp cutting 4. High grinding efficiency 5. High wear resistance 6. Low grinding force 7. Low grinding temperature 8. High precision, good surface quality 9. Good shape retention 10. Wide application range
Application
Vitrified bond diamond grinding wheel is suitable for grinding PDC cutter, PCD, PCBN cutting tools, natural diamond cutting tools,various hard alloys, ceramics, glass, jewelry, Molds, tools, precision grinding processing, metal ceramics.
Product Information
Size
100mm/110mm/125mm/150mm/200mm/250mm/350mm/400mm
Rough Grinding
W14 W28 W40
Fine Grinding
W10
Finishing
W5/W3.5
Special specifications and specify grit size can be customized according to customer requirements.
SAISU & Delivery
1.we could ship by Commercial Express,like UPS,DHL,FedEx,Aramex,we could also ship byair/by sea/by land as your request. 2. A tracking number will be updated within two working days once your order is shipped. 3. We are not responsible for any customs charges, taxes,or fee. For any details please contact your local customs office. 4. If you have not received your parcel, please contact us immediately for help. We will reply the email within 24 hours. NOTICE: Holidays and weekends are not included in working days.