Product Overview
Description
resin bond grinding wheel is made from phenolic resin with diamond or CBN. It has an excellent heat and abrasion resistance, and it is suitable for both dry and wet grinding so that it effectively performs when grinding glass, ceramics, carbide alloys, ferrites, refractories, semiconductors, and other electrical carbon products.

1F1
Grinding wheel used for manufacturing and resharpening of band saw blade
14VR Grinding wheel used for manufacturing and resharpening of band saw blade





6A2
Grinding wheel used for resharpening of straight knives
Product details
Tool worked
HSS and T.C.T. straight knives
T.C.T. reversible knives
Application
Sharpening
Machinery
Göckel
Reform
Ilmetech
Weinig Rondamat
MVM
Recommended configuration
Diamond - R26-C05 (grit size on demand)
Cubic boron nitride - CBN R26.2 (grit size on demand)
SHARP 14F1
Grinding wheel used for manufacturing and sharpening of HSS saw blades
Product details
Tool worked
HSS saw blades
Application
Tooth profiling
Machinery
Businaro
Recommended configuration
Cubic boron nitride - CBN RF1 (grit size on demand)
3V1M
Grinding wheel used for preforming of H.S.S. and carbide rods
14F1
Grinding wheel used for profiling of brazed tools
1A1
Grinding wheel used for manufacturing and resharpening of carbide and HSS end mills
14A1
Grinding wheel used for manufacturing and resharpening of carbide and HSS end mills
Grinding wheel manufacturer supplies CNC tool grinding machine (CNC) special grinding wheel 11V9 diamond grinding wheel
Customized CNC Five Axis Linkage Tool Grinding Machine Resin Diamond Grinding Wheel 1A14BT911V912V9
Customized packaging machine, alloy toothed blade angle precision grinding, 1EE1 molding resin CBN grinding wheel, 120 degrees
Customized 50mm cup shaped resin diamond grinding wheel for coarse grinding of tungsten carbide hard alloy with a particle size of 80/100 mesh
Customized 3V1 resin diamond grinding wheel with a single beveled edge of 50 degrees and an outer diameter of 150mm for grinding hard alloy blades
Customized 1V1 single beveled resin bonded diamond grinding wheel with 30/45/60 degree angle and optional SDC raw material
14A1
Resin single bevel diamond grinding wheel alloy tungsten steel saw blade bevel grinding butterfly resin grinding wheel grinding disc
Resin diamond parallel grinding wheel disc surface grinder, mechanical special sharpening machine, hard alloy grinding, tungsten steel grinding head
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Tool OD 5 inches 1A1 regular diamond wheel 125mm abrasive/CNC grinding wheel polishing wheel hole 1.25 inches thick 0.5 inches resin bonded
DAP alloy resin diamond grinding wheel mold stone grinding and polishing flat sand wheel saw blade cutting blade 1A1
Grinding semiconductor, solar silicon wafer, polycrystalline, diamond tool flat ceramic diamond grinding wheel 180D
Premium 618 surface grinder resin diamond parallel grinding wheel tungsten steel hard alloy grinding wheel
1A1 diamond resin grinding wheel parallel grinding wheel outer circle grinding plane grinding CBN grinding wheel
Applications: Flute Grinding, Surface Grinding, OD Grinding,
Knife Grinding, Profile Grinding, Centerless
Grinding
Bond Availability: Phenol, Polyimide, Hybrid, Electro-chemical
Available in: Diamond, CBN, CDX
Size Availability: 1" - 27"
*CDX Bond for Grinding Steel and Tungsten Carbide in combination
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Vitrified; Resin; Metal; electroplated; Vacuum brazed; Other |
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An enterprise mainly engaged in the production of diamond products. The main products include bowl-shaped, flat-shaped, cup-shaped, disc-shaped, and cylinder-shaped resin/ceramic/electroplated diamond grinding wheels; bowl-shaped, flat-shaped, cup-shaped, and disc-shaped resin/ceramic/electroplated CBN grinding wheels; grinding discs with a diameter of 600/500/550 for grinding brake discs; grinding heads; grinding heads; saw blades; diamond micropowder, etc. We can process some models according to drawings. Since its establishment, our company has followed the principle of "quality first, customer first" and won the praise of users with good product quality and perfect service. It is widely used in the mechanical processing of high-hardness and brittle materials such as wafers (semiconductor silicon wafers and solar silicon wafers), diamond composite sheets, diamond polycrystalline, diamond tools, cubic boron nitride, tungsten steel (hard alloy), new engineering structural ceramics, gems, crystals