New Arrival WL SOP U001 Adapter for VP598 VP898 Programmer

BGA Chips is MOISTURE SENSITIVE DEVICES.

Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125℃±5℃ x 24 hours or 80℃±5℃ x 48 hours

Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips: 245℃-260℃(Maximun)

Leaded/Pb BGA chips:180℃-205℃(Maximun)

Reel, Tray etc.

DHL/FedEx - 3~7 days
EMS - 12~33 days
China Post/SG Post/HK Post - 15~60 days

Nicole

Email : sales5(at)hklrf.com
Skype : lrfsales5