Product Overview
Description
MoCu alloy is a kind of pseudo-alloy that is composed of molybdenum and copper. It consists of both the characteristics of molybdenum and copper, having high thermal conductivity, low adjusted thermal expansion coefficient, Beijing non-magnetic, low content of gas, good vacuum resistance, good machinability and special high-temperature performance, etc.
Compared with WCu alloy, MoCu alloy has lower density and is easier to stamp, It makes MoCu suitable for valume produce.
Product Brief Introduction:
Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
Surface: Plating Ni, NiAu, NiAg, or Non-plating
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Product Properties:
Physical Properties of Major Products
Material
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Wt%
Molybdenum Content
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Wt%
Copper Content
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g/cm3
Density at 20℃
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Thermal conductivity at 25℃
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Coefficient of thermal
expansion at 20℃
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Mo85Cu15
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85± 1
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Balance
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10
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160 - 180
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6.8
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Mo80Cu20
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80 ± 1
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Balance
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9.9
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170 - 190
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7.7
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Mo70Cu30
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70 ± 1
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Balance
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9.8
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180 - 200
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9.1
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Mo60Cu40
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60 ± 1
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Balance
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9.66
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210 - 250
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10.3
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Mo50Cu50
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50 ±0.2
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Balance
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9.54
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230 - 270
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11.5
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Applications:
These composite are widely used in applications, such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.
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Product Brief Introduction:
Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.
The features of copper molybdenum copper
Large sized sheets available (length up to XXmm, width up to XXXmm)
Can be stamped into components
Strong interface bonding resist to 850℃ heat shock repeatedly
Tailorable CTE matching that of semiconductor and ceramics
High thermal conductivity
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Product Properties:
Materials
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Density at 20℃
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Coefficient of thermal expansion at 20℃
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Thermal conductivity at 25 ℃
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In - plane
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thru - thickness
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13:74:13
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9.88
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5.6
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200
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170
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1:4:1
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9.75
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6.0
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220
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180
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1:3:1
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9.66
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6.8
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244
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190
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1:2:1
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9.54
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7.8
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260
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210
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1:1:1
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9.32
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8.8
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305
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250
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Applications:
Applications are similar with W-Cu composites.
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mounts.
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Product Brief Introduction:
Cu/Mo70Cu/Cu(CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1:4:1. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components,.
Features of Cu/Mo70Cu/Cu
Large sized sheets available (length up to XXmm, width up to XXmm)
More easily to be stamped into components than CMC
Very strong interface bonding which can repeatedly resist 850℃ heat shock
Higher thermal conductivity and lower cost
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Product Properties:
Materials
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Density at 20℃
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Coefficient of thermal expansion at 20℃
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Thermal conductivity at 25 ℃
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In - plane
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thru - thickness
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In - plane
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thru - thickness
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1:4:1
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9.4
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7.2
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9.0
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340
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300
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Our products
High quality with reasonable price
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