Share on (60746826323):
| Tolerance for linear dimensions: | ±0.002mm at best | Straightness: | 0.02mm at best | |
| Tolerance for angular dimensions: | ±0°10' at best | Minimum hole diameter: | 0.5mm | |
| Surface roughness: | Ra0.05m at best | Minimum internal thread: | M2 | |
| Concentricity: | 0.02mm at best | Maximum external thread: | M20 | |
| Cylindricity: | 0.02mm at best | Available thread type: | Metric, UNC/UNF, BSW | |
| Flatness: | 0.02mm at best | Available surface finish: | as fired, grinding, lapping, polishing, metallization, glazed | |
| Parallelism: | 0.02mm at best |

Looking for top-quality ceramic heat sinks for your electronics packaging needs?
Look no further than our company! With over 5 years of experience in ceramic heat sink production, we are a leading provider of high-performance ceramic substrates for the electronics industry.
Our advantages include:
1.Over one million ceramic substrates produced annually.
2.Over a hundred custom ceramic heat sink designs accepted.
3.Serving numerous large electronics packaging companies in Europe and the Americas.
4.State-of-the-art production lines and extensive quality control experience.
5.More than five years of experience in ceramic heat sink manufacturing.
Whether you need high-precision ceramic substrates for your next project or customized ceramic heat sinks to meet your specific requirements, our team has the expertise and resources to deliver. Contact us today to learn more about our products and services!
Aluminum nitride (AlN) substrates are widely applied in large-scale integrated circuits or high power modules because of much higher thermal conductivity than other ceramic materials. Aluminum nitride susbtrates's thermal conductivity is as high as 170 w/mk, which will dissipate heat and cool down the circuits much more quickly. Adding with good insulating properties, aluminum nitride substrates are the best solution in electronics applications where fast heat dissipation is critical. Alumium nitride substrates are heat resistant and have similar expansion coefficient of silicon, which will keep high reliability of Si chip and thermal heat cycling.
Mascera produces high quality aluminum nitride substrates with customized sizes, standard thickness of 0.25mm, 0.385mm, 0.5mm, 0.635mm, 0.8mm, 1.0mm are selective for prompt delivery. No matter small orders for prototyping or bulk orders, we are always ready to offer our best service!

| ITEMS | UNIT | PARAMETER |
| Purity | % | 95 |
| Color | / | Light Grey |
| Density | g/cm3 | ≥3.3 |
| Water Absorption | % | 0 |
| Moh’s Hardness | / | 8 |
| Flexural Strength(at 25℃) | Mpa | 365-420 |
| Compressive Strength(at 25℃) | Mpa | 310-320 |
| Thermal Conductivity | W/m.k | ≥170 |
| Coefficient of Thermal Expansion(20~300℃) | 10/6/℃ | 4.6 |
| Max working temperature | ℃ | 1800 |
| Volume Resistivity | Ω.cm | 1013 |
| Dielectric Constant(1MHz, 25℃) | / | 9 |
| Dielectric Loss(1MHz, 25℃) | / | 3.8 X 10-4 |
| Dielectric Strength | KV/mm | 17 |









New products from manufacturers at wholesale prices