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Test Item | Test Value | Test Item | Test Value |
Color | White/Blue/Gray/Pink/Black | Thickness | 0.2~20.0 mm |
Specific Gravity | 1.8±0.1g/cc | Hardness | 18±5~40±5 Shore C |
8 kg/cm2 | Continuous use Temp | -40~+220 ℃ | |
5.88*109 Pa | Volume Resistivity | 1.0*1011 Ω-CM | |
Voltage Endurance | 6 KV/mm | Flame retardant | Yes |
Thermal Conductivity | 1W/mk-10W/mk | Thermal Resistance | 0.758 ℃-in2/w |
Thermal Impedance | ≤0.53 ℃.in2/W | Elongation | 100 % |
Size | Cutting into any size | OEM$ODM | Yes |
Advantage | Thermal/insulation/self-adhesive | Application | PCB/IC/LED, CPU |



Maoyuan Factory MY series thermal conductive silicon pad is high-performance, thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment and heat sink or product outer covering. Nice stickiness, flexibility, good compression performance and excellent heat conductivity are designed for MY200 series,which make the products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect.
The Thermal pad support customization and wholesale, large quantity with preferential treatment
Feature:
1. Super high thermal conductivity(1W-22W/mk)
2. Durable, insulating and non-conductive. Non-corrosive, non-curing and non-toxic.
3. Easy to use, no need to apply silicone grease, just tear off the protective film on both sides to use.
4. Various Thicknesses and Wide Application
(It can be used for heating elements such as CPU, GPU, graphics card, memory, mining machine, SSD solid state drive, notebook computer, game equipment, LED, server, household appliances, radiator, capacitor and resistor.)
5. High Quality.
Support to customize: size/thickness/color/shape/thermal conductivity

●\tHigh reliability & High thermal conductivity
●\tHigh compressibility, soft and flexible
●\tHigh conductivity
●\tNatural tacky for both sides, no need adhesive
●\tMeet with the environmental requirements of Reach

●\tThe filling between PCB and heat sink
●\tThe filling between IC and heat sink or product outer covering
●\tThe filling between IC and heat sink or product outer covering

●\tCommunication equipment
●\tLED Light
●\tSwitching power supply
●\tBack light model
●\tMedical equipment
●\tMobile equipment
●\tVideo equipment
●\tNetworking equipment
●\tHousehold appliances
●\tNote books

The size of the thermal silicone gasket can be cut according to the customer's requirements, and the special size can be die-cut. Easy to install. The manufacturer is convenient for mass production and the delivery period is stable.





Thermal Pad for PCB Board
Thermal Bad for Battery Pack
Thermal Pad for LED Lights
Thermal Pad for Heat Sink
Thermal Pad for CPU/MCU
Thermal Pad for Resistance











Q: Are you manufacturer?
A: Yes, we are a manufacturer has 10 years of manufacturing experience.
Q: How can I get free sample?
A: Free sample are available, and you only to pay the freight of express.
Q: What is the MOQ?
A: We don't have MOQ, we can accept small order.
Q: How long is your delivery time?
A: Generally it is 3-7 days, if the goods are in stock, or it is 3-7 days if the goods are not in stock, it is according to quantity.
Q: What is your payment terms?
A: We can accept T/T, Paypal, West Union, Ali Trade Assurance.

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