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FR-4 Process capability | ||
Item | Craft Ability | |
Surface Finish | HASL,Immersion Gold,Gold Plating,OSP,Immersion Tin,etc | |
Layer | 1-32 layers | |
Min.Line Width | 4mil | |
Min.Line Space | 4mil | |
Min.Space between Pad to Pad | 3mil | |
Min.Hole Diameter | 0.20mm | |
Min.Bonding Pad Diameter | 0.20mm | |
Max.Proportion of Drilling Hole and Board Thickness | 1:10 | |
Max.Size of Finish Board | 23inch*35inch | |
Rang of Finish Board′s Thickness | 0.21-3.2mm | |
Min.Thickness of Soldermask | 10um | |
Soldermask | Green,Yellow,Black,White,Red,transparent photosensitive solder mask,Strippable solder mask | |
Min.Linewidth of Idents | 4mil | |
Min.Height of Idents | 25mil | |
Color of Silk-screen | White,Yellow,Black | |
Date File Format | Gerber file and Drilling file,Report series,PADS 2000 series,powerpcb series,ODB++ | |
E-testing | 100%E-Test:High Voltage Testing | |
Material for PCB | High TG Material:High Frequence ROGERS,TEFLON,TADONIC,ARLON(Haloger free Material) | |
E-testing | Impedance Testing,Resisitance Testing,Microsection etc | |
Special Technological Requirement | Blind&Buried Vias and High Thickness Copper | |














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