2k Dosing system 2 component AB mixing dispensing machine Thermally conductive epoxy silicone compound potting filling machine
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- Supplier: Kapton Automation Equipment (guangzhou) Co. Ltd.
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Product Overview
Description
Product Description
Our ab two part gluing machine are nowadays used for many different purposes and their application fields are increasing everyday.
Potting and encapsulation is the process of embedding electronic components & assemblies in a liquid resin (potting compounds) to protect them against rough environment conditions. Potting can be performed in atmosphere pressure or even under vacuum, if high voltage insulation and high temperature differences are needed. Encapsulation of parts will stop corrosion of metals and reduce damage caused by vibration and mechanical stress.
We can handle 1- and 2-component polyurethanes, epoxies, acrylics, silicones - temperature, humidity and UV curing materials. They can be from low- to high-viscosity, filled or unfilled and even high abrasive for thermal conductivity.
Introduction to epoxy resin glue dispenser machine (potting machine):
Fully automatic glue potting machine for two-component AB glue epoxy resin/PU/Silicone. It can realize automatic proportioning, automatic mixing, automatic glue potting and sealing of epoxy resin. Automatic proportioning on demand to achieve mixing and dispensing, filling. On-demand and easy to manage;
Applicable epoxy resin types:
1, Various high, medium and low viscosities within 30000mPa·s
2, Glue mixing and potting with different proportions between 1:1 and 1:20;
3, Epoxy resin with high impurities, the ratio of glue and additives can reach 1:1;
Main functions of epoxy resin glue potting machine (ab glue dispenser machine) KPD-700
1. Fully automatic proportioning, mixing, quantitative glue potting and filling;
2. Touch screen display, monitoring, recording, and modification of the overall status information of the glue potting machine;
3. The glue discharge ratio, glue discharge speed, glue discharge time, and glue stop time can be adjusted at will;
4. The vacuum suction function of the glue outlet can avoid uneven glue discharge, wire drawing, bubbles, etc.;
5. One-button automatic cleaning of the mixing tube;
6. Automatic stirring of the glue bucket;
7. Vacuum degassing and automatic gluing in the glue bucket;
8. Glue bucket heating, pump, and pipeline heating;
9. Touch screen display, operation, full Engsllish interface, various parameter recording, display, alarm, high degree of intelligence, easy to learn and understand;
10. Double material barrel design, A glue and B glue are stored separately, and the bottom of the glue barrel is equipped with a liquid level sensor, which supports glue quantity monitoring and glue quantity alarm;
Potting and encapsulation is the process of embedding electronic components & assemblies in a liquid resin (potting compounds) to protect them against rough environment conditions. Potting can be performed in atmosphere pressure or even under vacuum, if high voltage insulation and high temperature differences are needed. Encapsulation of parts will stop corrosion of metals and reduce damage caused by vibration and mechanical stress.
We can handle 1- and 2-component polyurethanes, epoxies, acrylics, silicones - temperature, humidity and UV curing materials. They can be from low- to high-viscosity, filled or unfilled and even high abrasive for thermal conductivity.
Introduction to epoxy resin glue dispenser machine (potting machine):
Fully automatic glue potting machine for two-component AB glue epoxy resin/PU/Silicone. It can realize automatic proportioning, automatic mixing, automatic glue potting and sealing of epoxy resin. Automatic proportioning on demand to achieve mixing and dispensing, filling. On-demand and easy to manage;
Applicable epoxy resin types:
1, Various high, medium and low viscosities within 30000mPa·s
2, Glue mixing and potting with different proportions between 1:1 and 1:20;
3, Epoxy resin with high impurities, the ratio of glue and additives can reach 1:1;
Main functions of epoxy resin glue potting machine (ab glue dispenser machine) KPD-700
1. Fully automatic proportioning, mixing, quantitative glue potting and filling;
2. Touch screen display, monitoring, recording, and modification of the overall status information of the glue potting machine;
3. The glue discharge ratio, glue discharge speed, glue discharge time, and glue stop time can be adjusted at will;
4. The vacuum suction function of the glue outlet can avoid uneven glue discharge, wire drawing, bubbles, etc.;
5. One-button automatic cleaning of the mixing tube;
6. Automatic stirring of the glue bucket;
7. Vacuum degassing and automatic gluing in the glue bucket;
8. Glue bucket heating, pump, and pipeline heating;
9. Touch screen display, operation, full Engsllish interface, various parameter recording, display, alarm, high degree of intelligence, easy to learn and understand;
10. Double material barrel design, A glue and B glue are stored separately, and the bottom of the glue barrel is equipped with a liquid level sensor, which supports glue quantity monitoring and glue quantity alarm;
Specification
Models | KPD-700 Automatic Multifunctional Glue Potting Machine |
Suitable process: | It can be used as a stand-alone machine or with the customer’s original assembly line to achieve on-line gluing. |
Proportion of glue: | 10:1 – 1:1 |
hybrid approach: | Dynamic stirring mixing/static |
Machine Stroke: | 500x1500x100mm |
speed | X,Y axle 400mm/s |
accurate | ±0.05mm |
Programme stock: | 999 |
metrological | Teach-In Programming |
control method: | PLC+touchscreens |
input method: | Touch screen + buttons + IO |
Appearance Material: | Industrial square tube welding + 6061 alloy + cold rolled plate |
Drum size: | A barrel 30L, B barrel 10L (can be customised) |
External Dimensions: | 1100×1350 X1600mm |
Gum flow rate: | 1–80g/5sec (customised large glue volume available) |
trajectory: | Punching points, walking straight lines, curves, drawing circles, arcs, squares, and other irregular shapes. |
Supply Voltage: | AC220V/50HZ |
Company Profile
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Application range:
It is widely used in the field of electronic products, such as: capacitors, power modules, sensors, mutual inductors, transformers, batteries, LEDs, rectifier bridges, inductors, lightning protection modules, water meters, motors, high-voltage packages, etc. There are cases for reference. Other industries such as the building materials industry are also occasionally used.
Suitable automatic glue filling solutions can be provided according to different products.
Suitable automatic glue filling solutions can be provided according to different products.
Packing & Delivery
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