Silicon aluminum wire chip bonding machine wedge welding heavy wire bonder aluminum wire bonding machine semiconductor device

SH2000 ultrasonic wire bonding machine (hand bonding machine) is a precision circuit board after the process (COB) welding production equipment, which is mainly used in digital tube, dot matrix, integrated circuit soft packaging, thick die integrated circuit, transistor and other semiconductor device lead welding. The welding head frame of this machine adopts vertical guide rail up and down movement (Z-direction movement), the second welding movement (span) is realized by welding head frame horizontal guide rail movement (Y-direction movement), two kinds of movement are driven by imported stepping motor, so the first welding and second welding aiming height, arch wire height, jumper distance can truly achieve digital control, thus ensuring stable welding quality, accurate control of solder joints, high repetition rate of welding wire, arch wire height consistency good advantages; SH2000 Ultrasonic Wire Bonding Machine (Hand Bonding Machine) is a full-function COB, IC welding production equipment, this machine is suitable for the welding of many different aluminum wire parameters, such as toy integrated soft package sheet, mobile phone flashing lamp sheet, miniature camera integrated board, computer, telephone, music (voice) integrated circuit and thick die integrated circuit, sputtering film products and other semiconductor devices internal lead welding.