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Process Capability | ||||||||
Production imposition size range | 255*255~1100*720mm | |||||||
Production plate thickness range | 0.1~10.0mm | |||||||
Machinable plug hole material range | Epoxy / Metallic Inks | |||||||
Manufacturable Aperture Capability Range | Through Hole: Aperture Range, Maximum Thickness/Aperture Ratio Capability | 0.1~0.6/10mm/1:30 | ||||||
Blind Holes: Aperture Range, Maximum Thickness/Aperture Ratio Capability | 0.1~0.3/0.3/1:3 | |||||||
Stepped holes (such as back drilling): large holes, the diameter range of small holes, refer to the same plug hole as other small holes | ||||||||
Vacuum capacity when drilling | within 50-100Pa | |||||||
Minimum hole edge distance between non-plugged and plugged holes | ≥12mil(0.3) | |||||||
The minimum distance between the plug hole and the edge of the board | ≥10mm | |||||||
Ability to process boards with features such as hole edge copper cap protrusions | Vacuum plugging/grinding smooth | |||||||
Ability to process boards with characteristics such as copper particles in holes and plugging holes | Blocking more than one-third of the hole diameter requires positive and negative secondary plug holes | |||||||
hollow | / | |||||||
Sag Capability | ≤20μm | |||||||
bubble | / | |||||||
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