SMD Packaged Pressure Sensor For medicine filed

Feature

• Ranges: 0~100kPa…1000kPa(0~15PSI…150PSI)

• MEMS Technology

• Absolute

• SMD package(SO8)

• For non-corrosive gas or dry air

• Working temp.: -10℃~+100℃(-14℉~+212℉)

• Easy to use and embed in OEM equipment

Application

• For Small household appliances field, such as electric cooker,milk machine,purifier,coffee machine etc,medical instruments and device.

• For Automotive electronics field, such as tire pressure gauge,MAP sensor etc.

• For Other fields, such as massage appliance,air spring and air bed,animals blooding pressure equipment,gastrointestinal medical device etc.

   

Introduction

     XGZP170 is a piezoresistive pressure sensor that was designed for extremely space sensitive application where the sensing element is to be integral to the OEM products. The core is a silicon piezoresistive pressure sensing die that is designed and fabricated by MEMS technology. The pressure sensing die is composed of a springy diaphragm and four resistors integrated in the diaphragm. Four piezo-resistors build up a Wheatstone bridge structure. When the springy diaphragm is pressured, Wheatstone bridge produces a linear voltage signal(mV) that is proportional to input pressure.

With standard SOP8 package, It is easy for users to install by surface mounting or welding.

    With good repeatability, linearity, stability and sensibility, XGZP170 is very facile for users to calibrate output, thermal drift and make temperature compensation by using exterior operational amplifier or integrated circuit.

The pressure medium other than dry air or non-corrosive gas can’t be used directly. It is highly prohibited to choke the side of pressure diaphragm during actual application.

Performance Parameter

 Unless otherwise specified, measurements were taken with a supply voltage of 5 Vdc at

a  temperature of 25±1℃ and humidity ranging from 25%~85%.